Tremendous growth in mobile phones/devices, 5G network has led to enormous increase in amount of data transfer.
For HDI, high frequency applications, high speed electronic signals are necessary in PCBs. To achieve the optimum performance and reliability LILOTREE has launched this revolutionary, unparalleled solution.
Nickel-less solution: Low insertion loss
High reliability: No brittle failures at solder joints (including Lead-free)
Long shelf life: Au based surface finish
Cost-effective: Lower gold thickness (50 vs. 200 nm - EPIG, EPAG & DIG)
Eco-friendly solution: Cyanide-free & RoHS compliant
IPC 4552A Compliant
Eco-friendly solution: Cyanide-free rose-gold shine
Improves corrosion resistance by a factor of 10 (No black pads)- using proprietary Barrier Layer technology
No brittle failures at solder joints
Adaptable to fit your existing assembly process
Reduction assisted gold process (improves corrosion resistance further)
Up to 40% savings in gold material consumption vs ENIG and ENEPIG
Leave behind the cyanide-based matte yellow finishes!
Conventional ENIG and ENEPIG assemblies suffer from several known issues:
Corrosion ("black pad" defects), non-wetting to solder
Brittle failures at solder joints, component breakage
Non-uniform gold thickness, more expensive and less reliable
Over-plating or skip-plating issues on PCBs
